More or less in response to this question: Reliability of anti-static packaging
A few comments were made (which made sense) on manufacturers not really shipping many DIP packages in comparison with SMD devices. So my question is, should we expect this type of package to end eventually at some point, and is it just a matter of "whats left" in production.
It makes sense for a manufacturer of chips not to really care about hobbyists which only make up a small portion of their sales. But do you think the package itself will be phased out completely? (especially with Popular Boards like Arduino becoming even more popular?)