I've been practicing making PCBs using the photoetching process and I've come across a problem which I I haven't seen mentioned much on the Internet.
When I put the exposed board in the developer, some of the negative photoresist coating immediately starts dissolving in the developer and creates a brown cloud in the developer.
For developing, I'm using \$ 10 \mbox{ } g \mbox{ } NaOH\$ in \$1 \mbox{ } kg \mbox{ } H_2O.\$
My problem is that if any parts of that cloud come into contact with the PCB again, they will stick to it and the covered pieces will etch with great difficulty. They start etching just before the parts which were supposed not to be etched.
So any ideas how to prevent that?