This question is in reference to How to split Analog and Digital GND planes for a TQFN device.
For the PSoC3, the advice on how to separate the analog and digital ground is different depending on the package.
For the TQFP, it is suggested that the analog and digital grounds have separate ground planes.
But for the TQFN package, it is recommended that the grounds are all connected to the same ground plane (the thermal pad).
Why are these two recommendations different? (especially since Henry Ott recommends against it).
Does it really matter?