Timeline for What is the typical PCB fabrication process in a professional PCB house?
Current License: CC BY-SA 3.0
5 events
| when toggle format | what | by | license | comment | |
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| Jan 6, 2016 at 23:45 | vote | accept | jms | ||
| Dec 16, 2015 at 16:06 | history | edited | Ecnerwal | CC BY-SA 3.0 |
added 70 characters in body
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| Dec 16, 2015 at 16:04 | comment | added | Ecnerwal | Yeah, probably the outer layers were etched after the THP was done. Edited. | |
| Dec 16, 2015 at 15:31 | comment | added | jms | But if the surface activation (electroless copper) is done after etching, how do they prevent from plating over the entire board instead of just pads/vias/tracks? I can't imagine that they would etch the board twice in order to remove unwanted copper. Even if the unwanted areas are somehow masked before surface activation, plating the bulk copper still requires electrical conductivity to all surfaces being plated. | |
| Dec 16, 2015 at 5:11 | history | answered | Ecnerwal | CC BY-SA 3.0 |