Timeline for Connecting copper pours in Cadence (OrCAD) PCB Designer
Current License: CC BY-SA 3.0
4 events
| when toggle format | what | by | license | comment | |
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| Aug 11, 2017 at 4:59 | comment | added | bitsmack | I agree, @mkeith. Whether or not we're near a thermal limit, there are good solid reasons to not put vias under pads. If you leave them open, they wick solder from the joint. If you tent them on the top, the mask thickness holds the part away from the copper. If you tent only the bottom, expanding air and/or flux can disturb the joint. The good solution is to put plugged vias in pads, but this increases board cost... | |
| Aug 11, 2017 at 1:57 | comment | added | user57037 | Old thread. But this is not very good advice. Boards are very often designed this way. If the method of assembly is reflow, it does not create any problem, because the entire board is heated up more or less at the same time. The entire board and all the solder is hot. The part will not move because the solder mask will prevent solder from flowing away from the pad. A large fill does not imply that the solder mask is opened any more than normal. If the part has to be reworked by hand, it can be very difficult. But sometimes you just need to use the PCB as a heatsink to make the design work. | |
| Aug 20, 2016 at 15:56 | review | Late answers | |||
| Aug 20, 2016 at 17:50 | |||||
| Aug 20, 2016 at 15:39 | history | answered | audioTech | CC BY-SA 3.0 |