2 added 91 characters in body
source | link

When the die was attached to the leadframe and the epoxy encapsulant was molded over it, the leadframe was still connected to a larger structure (and probably to an array of other die locations).

The metal you see from the side of the package is where the leadframe was sheared of to separate this particular package from the others.

enter image description here

When the die was attached to the leadframe and the epoxy encapsulant was molded over it, the leadframe was still connected to a larger structure (and probably to an array of other die locations).

The metal you see from the side of the package is where the leadframe was sheared of to separate this particular package from the others.

When the die was attached to the leadframe and the epoxy encapsulant was molded over it, the leadframe was still connected to a larger structure (and probably to an array of other die locations).

The metal you see from the side of the package is where the leadframe was sheared of to separate this particular package from the others.

enter image description here

1
source | link

When the die was attached to the leadframe and the epoxy encapsulant was molded over it, the leadframe was still connected to a larger structure (and probably to an array of other die locations).

The metal you see from the side of the package is where the leadframe was sheared of to separate this particular package from the others.