Timeline for Is there a practical use for the Fibonacci sequence or similar fractal/sequence in Electrical Engineering?
Current License: CC BY-SA 4.0
8 events
| when toggle format | what | by | license | comment | |
|---|---|---|---|---|---|
| Oct 21 at 21:02 | comment | added | MicroservicesOnDDD | @horta -- You see... I knew Fractals were hot!!! ;-) | |
| Apr 25, 2023 at 5:32 | vote | accept | MicroservicesOnDDD | ||
| Oct 15, 2021 at 16:32 | history | bounty ended | MicroservicesOnDDD | ||
| Oct 15, 2021 at 16:32 | vote | accept | MicroservicesOnDDD | ||
| Oct 15, 2021 at 16:41 | |||||
| Oct 10, 2021 at 1:46 | comment | added | horta | @Hearth Thermal issues are exactly what the fractal design is working to resolve. Current crowding causes thermal hot-spotting. The fractal design allows more even thermal loading across the entire chip. That does mean overall, this chip will be capable of running hotter compared to a non-fractal design. | |
| Oct 10, 2021 at 1:28 | comment | added | MicroservicesOnDDD | @Hearth -- Did you read the cited paper. I couldn't because I don't have IEEE access. I found a related paper, "Design and Characterization of Highly-Efficient GaN-HEMTs for Power Applications" which I believe to be very closely related to the one cited by horta (becauses it contains these same diagrams in black and white). If you read the paper, maybe you will either be satisfied, or you can put your finger on what's bothering you. Page 70 begins section "4.4.5 Fractal-Structures for Power Devices". I believe, the Fractal design solves the thermal issues. | |
| Oct 10, 2021 at 0:03 | comment | added | Hearth | I feel like you may have thermal issues in a design like this, but I can't put my finger on why I feel that way. | |
| Oct 9, 2021 at 19:32 | history | answered | horta | CC BY-SA 4.0 |