Timeline for Decoupling capacitor and ground fill
Current License: CC BY-SA 4.0
3 events
| when toggle format | what | by | license | comment | |
|---|---|---|---|---|---|
| Aug 9, 2022 at 14:03 | comment | added | Tim Williams | @WAZO Probably, yes. | |
| Aug 9, 2022 at 14:01 | comment | added | WAZO | Thanks for your reply ! It's low power project, heat dissipation isn't a issue on this card. So, isn't it better to just get rid of the ground fill (or at least around the IC) and just using via connected to GND pad with a short track? The whole GND fill thing was essentially here to simplify the etching process for the manufacturer | |
| Aug 9, 2022 at 13:04 | history | answered | Tim Williams | CC BY-SA 4.0 |