Timeline for Why are some components missing areas of pour near mounting holes?
Current License: CC BY-SA 4.0
5 events
when toggle format | what | by | license | comment | |
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Oct 10, 2023 at 20:09 | vote | accept | CommunityBot | ||
Oct 5, 2023 at 19:55 | answer | added | feynman | timeline score: 0 | |
Oct 4, 2023 at 22:14 | comment | added | vir | What Chester Gillon says sounds right but double check that's the copper layer; not to imply that I've seen every implementation of thermal reliefs, but I've never seen that implementation, with square-profile nibbles taken out rather than the "border + spoke" way of doing it. | |
Oct 4, 2023 at 21:30 | answer | added | Chester Gillon | timeline score: 3 | |
Oct 4, 2023 at 21:20 | history | asked | user298907 | CC BY-SA 4.0 |