They looks to be Thermal Relief pads to aid in manufacturability.

From some searches:

1. Thermal Relief Design Guide for Your PCB for Altium
2. PCB Thermal Relief Guidelines for Effective Layouts for Cadance

Relevant part from the Altium article:

A thermal relief pad provides a way to keep heat confined to a pad for mounting a component to a printed circuit board with solder. The pad for a component normally peaks through the solder mask, allowing solder to be placed on the pad during assembly. Some copper is removed from the edge of a thermal relief pad, allowing heat to be confined in the pad when applying solder during assembly.

They looks to be Thermal Relief pads to aid in manufacturability.

From some searches:

1. Thermal Relief Design Guide for Your PCB for Altium
2. PCB Thermal Relief Guidelines for Effective Layouts for Cadance

Relevant part from the Altium article:

A thermal relief pad provides a way to keep heat confined to a pad for mounting a component to a printed circuit board with solder. The pad for a component normally peaks through the solder mask, allowing solder to be placed on the pad during assembly. Some copper is removed from the edge of a thermal relief pad, allowing heat to be confined in the pad when applying solder during assembly.

Edit: In response to the comment, I have no direct experience of calculating the effect of Thermal Relief pads on the current carrying capability of the component or increase parasitic inductance, but found the following:

1. Thermal Relief Via Design for Proper Impedance from Altium
2. Does adding thermal relief on PCB increase electrical resistance? answer on stackexchange