Skip to main content
12 events
when toggle format what by license comment
Dec 23, 2016 at 18:29 comment added JYelton @Segei Yes, a signal layer where the pad connects to a trace rather than a plane should not need a thermal relief. If the trace is large, there may be exceptions.
Dec 23, 2016 at 9:15 comment added Sergei Gorbikov +1, awesome answer. Is it true that for a through hole pad a thermal relief pads are necessary only on plane layers (PWR and GND)? On signal layers (bottom and top) there is no need for a thermal relief pad, isn't it? 10x.
Jul 18, 2014 at 4:04 comment added JAMS88 This answer is REALLY good, but you should give a look to this answer to a similar question that makes a lot of sense, so basically depends if your board of gonna be soldered by hand (then you put thermal relief ) or in oven (then you don't put thermal relief).
Sep 20, 2013 at 16:26 comment added scld For thermal calculations, although not precise, you can mostly assume the change in thermal resistance is proportional to the change in electrical resistance. So, your 4x increase in resistance (which, as you said, is still only an incremental increase) gets you on the order of 4x "easier" soldering. The thermal equations bear a striking resemblance to the electrical ones.
Sep 20, 2013 at 1:44 history edited JYelton CC BY-SA 3.0
Clarified "empty space" to mean one such space rather than all four
Jul 19, 2013 at 11:44 history edited Phil Frost CC BY-SA 3.0
correct and format math
Jul 19, 2013 at 9:10 vote accept user2578666
Jul 19, 2013 at 9:03 history edited JYelton CC BY-SA 3.0
Added footnote.
Jul 19, 2013 at 8:54 history edited JYelton CC BY-SA 3.0
Added image and rough math.
Jul 19, 2013 at 8:36 history edited JYelton CC BY-SA 3.0
Added image.
Jul 19, 2013 at 8:29 comment added user2578666 That makes since. Its that electrical resistance also increases but the increase is not that significant compared to thermal resistance
Jul 19, 2013 at 8:22 history answered JYelton CC BY-SA 3.0