Timeline for Solder stop mask and tinning sequence
Current License: CC BY-SA 3.0
7 events
| when toggle format | what | by | license | comment | |
|---|---|---|---|---|---|
| Nov 5, 2015 at 3:03 | history | tweeted | twitter.com/StackElectronix/status/662102869353590784 | ||
| Nov 4, 2015 at 22:39 | answer | added | David Drysdale | timeline score: 1 | |
| Sep 12, 2013 at 12:00 | comment | added | Tut | Not my area of expertise, which is why I did not answer. It depends on the plating and your soldering process. If you hand solder, I think it doesn't matter; otherwise I think you may want SMOBC. I think the type of plating needs to match the process (SMOBC or not). | |
| Sep 12, 2013 at 11:47 | comment | added | 1amtoo1337 | Meaning I should only tin the exposed pads after applying the soldermask ?? | |
| Sep 12, 2013 at 10:55 | comment | added | Tut | I think it depends on what you are plating with and how your board will be soldered. Research SMOBC (solder mask over bare copper). SMOBC helps prevent flow of molten metal under solder mask. | |
| Sep 12, 2013 at 8:04 | history | edited | JYelton | CC BY-SA 3.0 |
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| Sep 12, 2013 at 3:54 | history | asked | 1amtoo1337 | CC BY-SA 3.0 |