I am having an issue with clearances around pads and vias in EagleCAD, when milled on a LPKF S63 milling machine. I am a student myself but in my final year, and helping out by making a small BoosterPack board for the TI Launchpads.
The board will be then be printed by the 1st semester students, and then soldered. As they are new to soldering I wanted to give them extra clearance room around the pads. So I have increased the clearance around the pads to 40 mils. Now when I come to print the milling machine cuts an extra trace so there is 40 mils space from the ground plain, but there is still a small piece of copper left as an island in between. See the image and the area's marked in red to help with the explanation.
The LPKF is a new machine so not got to grips with it fully, and unsure if I am missing a setting in EagleCAD, or if I need to check for an adjustment on the milling machine. The next 2 images show the design rules settings, and also a small segment of the board layout in EagleCAD (grid settings 1.27mm).
So basically I want to remove all the excess copper remaining between the ground plain, and the outer edge of the annular ring.