This is a very complicated problem that has many caveats and qualified answers. This is just a general overview copied from my comments.
As a rule of thumb heat will always decrease the lifetime of the device, however this may still be longer than the expected (warranted) lifetime.
All electronic components will fail, eventually, the question is amount of time and method of failure (Quiet fail safe, or dramatic "heat event"). Your goal as a designer/integrator is to identify the effective lifetime and acceptable failure modes, then work to qualify the device or design workarounds.
In the worst case, if there is no suitable alternative a workaround may be active cooling.
Your best bet is to purchase a few samples and do some tests at 50C and perhaps some accelerated tests at 70C in order to determine if it meets the performance and lifetime characteristics you need.
Designing this type of test is beyond the scope of this Q&A, but there are commercial facilities that will rent you time on a thermal test chamber and expert advice, or you can try something yourself.
Make sure to place temperature probes on certain parts that tend to be hotter than ambient (e.g. power regulators and filter caps) in order to make sure you are not exceeding their rating.
Additionally Note that for ceramic capacitors, the class of dielectric matters. Class 2 (e.g X7R) which happens to be the most common type (Best Price vs Size vs Rating) , have a large temperature dependence. Class 1 (e.g. NP0 or C0G) have almost no temperature dependence. These relationships may impact the operation of the device even if it does not fail or significantly affect lifetime