I'm currently designing a PCB with double side components and I'm limited to 6 layers max. The project has couple of MCUs at 84 MHz. There are USART, I2C, SPI, some analogue lines and high-power lines in the design but not any high-speed lines. There are also some very short RF lines for antennas.
The problem is due to the high density and limited size of the PCB I can't use this stackup: S-G-S-S-P-S At some parts of the PCB specially around the high pin count MCUs there's need for signal lines to go through the ground or power plane.
Also all the power electronics and switching components are on the back side.
This is the stackup properties provided by the PCB manufacturer:
So my main concern is if routing some signal lines through the power/ground plane will cause me problems or not?