I'm designing an "Internet of Things" appliance where space and layout are constrained by mechanical and cost requirements. The main processor is a PIC18 and its crystal (probably 8MHz, maybe 16) is mounted close to some things I regard as "scary" from an EMI point of view:
- (~5mm away) A (2.4GHz) WiFi module (a PCB-with-shielded-can-on-top style module which solders onto the main board - the "business end" is to the top left of the module so as far away from the µC and xtal as it can be).
- (~10mm away) A small DC gearmotor (mounted a few mm above the board on a metal 'L' bracket which is grounded to the PCB).
- (~15mm away) A3906 motor driver IC and associated power components.
I've looked over a few other "how's my crystal routing?" posts here and it seems like mine is probably OK (though I'd really welcome any criticism) but I am a bit worried about the nearby noise sources, especially as this is a solar + battery powered device that will be minimising power consumption as much as possible including minimising the power drawn by the oscillator.
I have given the crystal section its own ground planes and connected these to the bottom main ground plane at one of the PIC's VSS pins, so there will be return current on this pin but presumably not via any of the oscillator circuit.
- OSC1 goes µC<>cap<>xtal and OSC2 goes µC<>xtal<>cap - is this OK?
- Is the local ground plane around the xtal area going appreciably to increase the power draw of the oscillator?
- Is the way I've connected the system & crystal grounds together sensible?
- The top & bottom ground planes for the crystal are tied together with 3 vias but there is a return path that doesn't go through any of them. Is this "right"?
- Are any of the above noise sources likely to be an issue and if so how might I mitigate this? (the rest of the PCB is full up, so "move it further away" isn't really an option)
2 layer board. Top red, bottom blue, white area around crystal & caps is a cutout from ground pours on top and bottom, returning via the via (ha) next to one of the two VSS pins on the PIC18 (other one is on the other side of the chip). White hatched is the top soldermask stop (motor bracket grounded to topside ground pour this way). 8 mil traces & .5mm via drills.
Below the crystal you can see the motor mounting bracket (red) and motor outline (cyan). Motor driver in extreme bottom right. BR corner of WiFi module to top/left.
Edit 1: Improved grounding around signal traces in bottom right area below motor.