Temperature rise is something you have to consider, but usually the resistance and the resulting voltage drop at full current have been the limiting factors when I've gone through this. That said, 100°C is a large temperature rise. That's not enough to be a problem for a copper trace on a FR4 board by itself, but that's going to affect the apparent ambient temperature for nearby components.
If you have that much temperature rise, you're dissipating significant power in the trace, which means power loss in your system. Again, the first concern should be how much voltage drop you can tolerate. Once you get that to acceptable levels, the temperature rise is usually low enough.
Also consider that 2 oz copper and more is widely available. The extra cost of specifying 2 oz copper for outer layers may be less than making the board larger or dealing with the heat or voltage drop. 2 oz on outer layers doesn't usually add that much cost. If you stitch together a trace on both outer layers, you have 4x the copper cross section than for a single trace of 1 oz thickness. If it's only one or two traces in a otherwise low current design, you can leave the soldermask off the trace and have a copper wire soldered over the trace. There are actually bus bars meant for this. However, consider the manufacturing cost. 2 oz copper may start to look like the cheap option when you consider the total cost of alternatives.
Again, look at all the options and all the criteria for deciding on trace width. Don't just focus on temperature rise, or assume that thicker copper is more expensive once the whole system is considered.