I've printed, populated and baked a test PCB with most components that I needed. I left off a GPS chip and associated passives because the GPS chip itself costs more than the rest of the board, and I'm testing unrelated functionality at the moment (and I thought there would be a good chance that I'd have to change something). That said, the stencil was made with the GPS components in mind, and those pads are now covered with solder.
Would simply covering all the pads with flux, populating the components and reflowing again work?
I'm doing all of this by hand, and would prefer to avoid having populate another 100+ BOM lineitem board. The IC itself is an LGA 69 package, and the passives are mostly 0402.