I have a very dense BGA footprint. There is no way I can place the via between the pads - the PCB manufacture's tolerances do not let me. Also, the thinnest allowable traces do not fit between the pads. One way to do this was place via right under the pads. But because of the via's hole right under the pad, I am afraid that I might not solder it properly (the pad diameter of the via is essentially equal to the pad for the BGA ball). Filling the holes with non-conductive material costs 5x more expensive. Should I look for a component with the larger BGA pitch, or not filling the via will be ok?