This question springs from an answer here.
When using stripline configurations for rf signalling, the conductors are routed on an inner layer of the pcb, sandwiched between two ground planes.
I understand that vias cause mismatches in the characteristic impedance, which I would like minimize. My frequencies are 2.4 GHz and 3.5 GHz.
Which aspects should I consider when carrying rf signals through vias? For example:
- Drill size
- Annular ring thickness
- Distance from rf source