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As known most of modern Intel CPU has contact pads instead of contact legs (pin). This makes it impossible to solder them onto the motherboard.

But are there any Intel CPUs which have contact legs (pin) and how to find them here http://ark.intel.com/ ?

Are there any embedded Intel CPUs that can be soldered?

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    \$\begingroup\$ I recently bought a Avoton C2750 motherboard and I'm pretty sure that was soldered to the PCB. But it's a FCBGA1283 package not a hand soldering job if that's what you mean. \$\endgroup\$ – PeterJ Jan 24 '15 at 14:47
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    \$\begingroup\$ Why would you want to? Usually understanding the problem is half the answer. \$\endgroup\$ – jippie Jan 24 '15 at 14:54
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    \$\begingroup\$ Hah! What makes you think soldering is "shock" proof? :). Show me your shock proof soldered system and I will break it on my shaker table :). Also one reason a lot of faster processors are in sockets is because of thermal expansion. Because of the thermal difference in the part vs the board the part expands more the motherboard which can easily break joints or crater pads. \$\endgroup\$ – Some Hardware Guy Jan 24 '15 at 17:16
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    \$\begingroup\$ @Alex: en.wikipedia.org/wiki/Intel_Atom_(CPU) \$\endgroup\$ – Laszlo Valko Jan 24 '15 at 17:42
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    \$\begingroup\$ Please use correct terminology. Some processors are socketed (pins settle into a socket which locks). Some processors are leaded (meaning that they have pins, and I think this is what you are referring to) and some processors have some type of grid array (for example a ball-grid array or BGA). Both BGA and leaded processors are soldered onto the board. But BGA's are soldered using an oven process rather than wave or soldering iron. \$\endgroup\$ – mkeith Jan 24 '15 at 23:15
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Of course they can be soldered. That's how they are mounted to the board during manufacturing. The BGA (ball grid array) style of package you are referring to needs special equipment to solder, but absolutely it can be soldered. That's how it's intended to be used.

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  • \$\begingroup\$ Thank you! But is there any standard that describes how it should be done or what is the name of this special equipment to solder BGA (ball grid array) to find it? \$\endgroup\$ – Alex Apr 26 '15 at 14:42
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    \$\begingroup\$ @Alex: The datasheet should give information on the soldering temperature profile. The equipment is just ordinary stuff for any volume assembler. You need something that applies solder paste according to the stencil, a pick and place machine to accurately place the package onto the board, and a reflow oven to do the actual soldering. \$\endgroup\$ – Olin Lathrop Apr 26 '15 at 14:46
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You want a leaded, possibly hand solderable cpu in a world of bga/lga cpus... Ball/Land Grid Array are leadless package types, which are soldered, using wave/reflow soldering. Modern x86 processors require hundred of connections, which leaded packages are not good at.

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  • \$\begingroup\$ Minor nit, not wave/refow, just reflow. Wave soldering is for thru hole and wouldn't work on a BGA package. \$\endgroup\$ – Olin Lathrop Apr 26 '15 at 14:48

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