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I was just about to create a footprint for a Kingbright LED from the KP-2012 series. From looking at the data sheet I am somewhat irritated:
As you can see, the package pad with is 1.25mm, while the actual solder pattern width is only 1.1mm.
Why would this be desired?
It probably has to do with optimizing self-centering and prevention of 'tombstoning'. The HSMX-C670 has a similar recommendation.
