Designing a 4-layer board (signal+pwr, gnd, signal+pwr, gnd), and I have some newbie doubts about the best option to connect different connector's pin or IC's pad to power lines, or sometimes to different signals. Board has different parts: Power, MCU & RF.
The main issues I have:
- Power at connectors. Which is the design guideline to right connect these pads? Will this type connection create EMI which affect to RF module?
- Power planes instead of traces. Which is the design guideline for routing at this situations? I think plane, instead of traces, will be better to reduce EMI and impedance, but I'd like to have a second option due to I'm worried about how it would affect to RF.
- Best layer for planes. I would have to create several planes to connect different voltages on top layer, is this suitable? On the internal signal layer, there's only a power plane and trace.