Placing ground vias all over the PCB (stiching) to improve the EMI.
- Have all ground vias to be spaced the same distance? Or may they be separated different distances if it is under lambda/8?
I mean, I have to place ground vias all over the PCB edge to reduce EMI. The space between these ground vias are below lambda/20, around the edge. But the doubt comes from the ground vias which are not at the edge.
- Have these ground vias to maintain the same distance between them? How can I calculate the maximum number of them?
- Is there any rule of thumb to do it manually?