Hopefully I'm not doing anything illegal, I posted a very similar question a few days ago, but this one is different.
Here is what I've been working on the past couple days, trying out different software finally settling on Eagle. Its a simple mic+opamp module that I want to get printed.
I'm not looking to do SMD, just want to create a board where I can solder on DIP/through-hole components. (I have done copper pour ground on both layers BTW)
So the questions I have are:
1.Should I be using curved traces?
2.Are the green rings the copper rings where I can solder?
3.Is there anything missing from the board layout? (I'm sure there is...)
4.This is where I'm concerned: are the part sizes going to be OK? Are the distances the between the holes for parts standardized or do they differ?
5.Have I chosen the right part for the interface pins? I just want 3 holes that I solder wires to.
@Steven, I re-did the PCB design on one layer upon your recommendation. It turned out to not be all that hard, and it was good practice. What do you think? Although I think I did something awkward here: I put two resistors underneath the opamp IC, beause I figured I could use SIP sockets to elevate the IC and fit the resistors under it. Is this OK?