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I am trying to create a footprint for a LMR61428 but the datasheet (linked) only has the package outline and nothing for the recommended land pattern, or footp for a PCB design.

I found this image on TI after a fair amount of searching for a VSSOP-8 package which is what the LMR61428 claims to be but I am not 100% confident this is actually the correct one - the pitch of the pins are correct but I am not sure about the overall sizes that it gives.

It seems that it should work, but I just wanted some clarification before it gets further down the line in my design!

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Adding to Sanjeev's point, below comparison indicates that Land pattern can be shared. If still in doubt, ask TI.

enter image description here below is Land Pattern of OPA4170. enter image description here

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Why not you refer the below datasheet

http://www.ti.com/lit/ds/symlink/opa4170.pdf

Page 22-23

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Pay careful attention to the device's specification sheet. Land layouts for VSSOP-8 is NOT a one size fits all. Under TI VSSOP-8 I found at least two different package widths. The pcb pad layout dimensions and ic package dimensions are towards the end of the TI datasheets that I have seen. Use the one for the device and figure some way to keep them clearly denoted in your CAD libraries to avoid getting bitten with "throwing stars" for pcbs.

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