I'm looking for a good solution on how to design a thermal pad that is good for solderpaste assembly.
PCB fab that I'm using can't place any soldermask on vias like in this example:
And I'm not practic to design this pads. As I read on some documentations this vias, with solder on them, can suck solder creating problem on IC fixing and possible solder short circuits.
I tought about placing vias on the corner and with a solder stencil place solder only on the inside of thermal pad. But I don't know if it's good.
Can someone advice me a good method?
Also, I've an additional question not really related to this. I've read about decoupling (Decoupling caps, PCB layout) that every ground local plane should have only one spot to main ground plane, but in this case we have a lot of them, it can create problems?