We are designing a board (RF) which also has an RF amplifier that emmits a 5W signal. Unfortunately,as its a space PCB we cannot have a ground or copper por that can dissipate heat. More over the absence of air in space will prevent dissipation of heat into the ambient area.
If there is kind of vaccum without any air around, how will heat be dissipated ? What are the implications ,impact of a design such as this ? How can I reduce the heat generated in this way ?
Would the apt way be revising the BOM to select components of a better thermal resistance ? Kindly advice please ?