I am currently evaluating the performance of various cooling strategies of a high-dissipation toroidal core inductor. The inductor specs:
- 20mm diameter core
- 9 turns (=very sparse), 16ga
- 5W core losses (max)
- 2W Joule losses (max)
- High voltages may occur between heatsink and the conductors
- Heatsink on one side of the inductor, coplanar with the core at about 1.5mm distance from the outside of the turns
I am currently evaluating cooling strategies for this relatively high power density component. One of these strategies is using thermally conductive potting compound. However, I am a bit lost. Can you help me with:
- Evaluating whether this compound is the best I can get (for evaluation purposes - price is not terribly important)
- Explaining how I would go about (roughly) calculating the temperature drop over the potting compound if I use this compound to space-fill between the inductor and an aluminum heatsink
The shape is obviously quite irregular, so it's not immediately obvious to me how to attack this calculation. Especially as the core is the main source of heat here.