I've just received a batch of assembled PCBs where the manufacturer changed the previously used HAL-process to OSP.
Now there is a lot of open copper on the pcb, like on big inductors which "suck" a lot of the solder paste to their leads. There also is a blank surface now which was never meant to be covered with solder paste but only with the Tin from the HAL-process to keep the area leveled.
Does anybody have a clue how that "open" copper might change in the future? Is the protection of the OSP still their after soldering or will the copper start to oxide now?