I understand the wave solder process for pin soldering, I have seen videos and read literature while pot solder is used for tinning purposes.
My question is about why we requires the solder to flow.
1- wetting process: Q: why the wetting requires the solder flow in the Nozzle q: why the nozzle full of solder but not flowing would not wet, based on wave flow needed?
Q: how could we use small pot to solder edge pins connector to pre-built board without hand solder and without damage if I can get the hot solder in the nozzle in a small pot, but not flowing, but remains at the temperature during the soldering period?
or is that not possible without the flowing process in the nozzle?