Can anyone tell me how difficult, time consuming and expensive is to reverse all layers of a die ? Say a die from a recent model SoC Processor IC found in smartphone devices such as the Qualcomm Snapdragon SoC IC ? Also is it possible to de-cap safely an IC using a houshold kitchen microwave ?
Without super high resolution X-ray machines and a scanning electron microscope you won't be able to reverse engineer a modern chip. The node process used is probably sub 100 nano meter. The post and subsequent article that you quoted is about reverse engineering a very old chip with less then at most tens of thousands of transistors. The Qualcomm Snapdragon is in the millions.