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What is USON package? Is it the same as UTDFN (ultra thin dual flat no lead)? What is the typical pin formation for 8-pin component?

  1. 4 pin on 2 side?
  2. 2 pin on 4 side?

What's the different with QFN?

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2 Answers 2

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It looks like SON and DFN refer to the same package. JEDEC documents like this one talk about "SON/QFN", but on the whole JEDEC site I couldn't find one reference to "DFN".

On the other hand, among its dozens of packages Linear Technology lists DFN and QFN, but there's no trace of SON.

JEDEC describes the USON as:

The Plastic Ultra-Thin Small Outline No-lead Package(USON) is a rectangular semiconductor package with metal terminals along two sides of the bottom of the package. The terminals are either flush with bottom or protruding slightly below bottom of package. The main body of the component is generally a molded plastic.

So a SON package, having its terminals on two sides, is much like a DFN. So 4 pins on 2 sides would be SON/DFN. A QFN-12 may have 4\$\times\$3 terminals, but other configurations like 2 \$\times\$ (5 + 1) are also possible.

enter image description here enter image description here

This may cause some confusion if we look at the following package:

enter image description here

which appears to be a DFN-16 and not a QFN-18.

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I think they are 4 pin on 2 side with central thermal pad from what I have seen. Like a smaller version of WSON. I have seen them referred to as USON/UDFN. As regards QFN, not sure of the exact definition, though I think a QFN is usually larger/thicker, usually square and often with no thermal pad. JEDEC is a useful reference for packages (log in needed), and here is a TI page I find useful from time to time also.

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