Eventually I see power traces on both sides of dual layer PCBs that have lots of massive vias, do the vias help the traces handle more power? Does it increase heat dissipation and/or decrease resistance?
I sometimes see them in PCBs with the same trace on both sides, so the via's function apparently is not to carry current from one side to another.. is it adding thermal mass or..?
Is there a rule of thumb/graphs/calculations/application notes for this? Or is it more empirical/case specific?
Info about vias for PCB heatsink pads for power ICs is quite common but I couldnt find much about traces.
I know there are other methods of increasing power handling and heat dissipation for traces, but I'm specifically curious about this method. I think I'm not referring to PCB stitching of RF planes.