I'm working on a charger circuit which basically works as a buck-converter. I'm pouring my components with copper planes.
However as some of the components are connect to a large ground plane on bottom layer I suspect the best choice is to use thermal relief to ease soldering. However, should I do the same on the top SMD components?
I know there is pros and cons using thermal relief, but when should it be used and when not?
See below for the layout described above