Due to fabrication process, there will be variations, among wafers as well as among dies across a wafer. My question is that what variations are significant between dies? And what variations are significant between wafers?
Thanks very much!
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\$\begingroup\$ Way too many to just list. You need to do your own research and ask about exactly what confuses you. \$\endgroup\$– AsmyldofCommented Nov 20, 2015 at 8:14
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\$\begingroup\$ My survey paper on process variation may be of help. (The question is not very clear to me.) \$\endgroup\$– user984260Commented Dec 10, 2015 at 13:14
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1 Answer
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The variations between dies are somewhat dependent on the distance between the dies, and also generally on the position of the die on the wafer -- often you find patterns of variation in a ring around the edge of the wafer, or a crescent shape around the edge.
What is significant is a qualitative term, but in certain cases, those variations can cause some die to have parameters that are out of spec.
