Possibilities tried or considered:
- Split the package using wire cutters - sometimes works and sometimes doesn't
- Grind the top off with grinder - Some chips have no cavity between the die and the cap.
- Soak in MEK - I heard this works but haven't tried it.
Why would I want to do this? To photograph for forensics purposes - to look for damage or to get die numbers. I don't expect the part to function afterward. Electronic forensics labs seem to be able to open chips easily but I'm not sure what tools/techniques they use.