I have been reading up on grounding and what is AGND and DGND i.e / analogue ground and digital ground respectively. Suppose , I have an ADC chip and a MCU in a PCB. Now, previously I would have a ground plane beneath them and split them into Analogue ground and digital ground. I have now realised that splitting the ground planes will be detrimental to my return path at higher frequencies of the signal.
So, the best way is to have a single ground plane or have 2 different ground plane which is connected by a ferrite bead. Then during layout remove this bead to have a thin connection between the 2 grounds.
But, this approach has an issue according to me, which might be wrong. Will this thin line not act as a sort of high impedance that blocks currents thereby making the 2 grounds at 2 different potentials ?