Is there any estimation regarding the relation between PCB pad to pad distance and isolation strength?
If the board is covered with the mask and the minimum distance is 2,9 mm which isolation voltage I can expect?
The red region is the isolated nets.
The age effects (like surface dust) can be skipped in my case as the device will be packed and protected from such particles penetrations.
Actually I need 2 kV isolation. But I'd be much more happy to know the science behind the subject - not only estimation that my design will or will not keep this voltage. This is why I skipped to specify my actual requirements initially.
After I read the links I've been provided by you I could put the idea in the following form: as I need to withstand 2 kV test (as per my initial requirements) I will redesign the board (if necessary) and then after assembled put it to the test of 2 kV AC voltage applied and than test the insulation resistance which is should be more than 2MOhms @ 500VDC.
So the questions now are:
- Is the stated above correct? Is this any proper approach?
- How likely that this PCB as it designed right now on a picture above will pass the test (U2 optocoupler is rated to 3,75 kV RMS). As I stated earlier the minimum distance is 2,9 mm from primary to secondary.