I am working on a board design that is near the limits of the PCB fabricator's capability. It uses 4mil stacked microvias, via in pad, blind and buried vias, 3 mil trace/space, buried capacitance (1mil dielectric), 12 layers, 1mm thickness, controlled impedance, etc. I was wondering if this is standard technology for modern smartphones (iPhone, HTC, Motorola, etc), or are they somehow getting by with looser design rules.
I am just wondering if the industry is making these types of boards by the millions. The reason I'm asking is our customer does not like to use technology on the bleeding edge due to reliability concerns.