In the manufacture of NAND flash (to my understanding):
- Wafer is produced
- Dies are probed for testing
- Dies that pass testing are configured as Tier-1 chips, then packaged.
- Dies that fail Tier-1 testing are modified (if possible) so they have reduced capacity, for example a 128 gigabit die has defective sections configured as unavailable yielding a die with 64 gigabit capacity.
- Successfully downgraded dies are packaged (for example in TSOP-48) but not marked with the manufacturer logo, part number or serial number.
- Finished ICs are sold to manufacturers for use in inexpensive USB Flash Drives.
My question: What is the proper term for these downgraded NAND Flash ICs?