I am new to this forum. I am building a prototype board which uses a 48 pin LQFP 0.5mm pitch IC including other components. Included on the board I have 1206 SMT components and SOIC components.
All components reflow well however the 48 pin LQFP keeps shorting during the reflow.
My board is professionally made but it does not include silkscreen and solder mask (bare proto board). I am also using a stencil. I have read that this type of board could cause shorting of pins with fine pitch components during reflow.
I am using a DIY home-made toaster oven following the general temperature curve for solder reflow.
I have tried applying various amounts of solder paste with no luck.
Any suggestions how to successfully solder such a component to the board?