There should be a standard JEDEC footprint that would be suitable enough for that part, and Altium has PCB footprint distributions that should contain what you need:
You will want to analyze the prototypes to ensure you have a good solder joint with an appropriate amount of solder and fillet and tweak the footprint for that part accordingly. Keep in mind that even with datsheets, slightly different solder formulations, slightly different process temperatures and stages, etc will all affect the solder joint, and for the best reliability you will end up customizing all your pads to their individual parts based on your analysis of the resulting joint.
The datasheets and JEDEC guidelines are just that - guidelines. Don't assume that just because you have a compatible footprint that your joint is reliable and strong.