I am asking a question on behave of a colleague who's struggling with the following. Does the relocation of the ground bonding point on a CAN bus ground shield make a difference? In the photo below the scenario of the before and after. The bonding point was 3" away from the connector, it will be now 10" away. I did some research on the topic which is completely new to me. My thoughts are that it comes down to a factor called the shielding performance of a cable which is indicated by its transfer impedance Zt. The transfer impedance relates a current on the surface of the shield to the voltage drop generated by this current on the opposite surface of the shield: Zt = U2 / (I1 x L) where L is the cable length.
It says impedance but I don't see the frequency factor in that equation. I am really not sure about this and any help is appreciated.