I'm soldering up some boards with smd parts, using a hot plate to reflow, and I'm (inevitably) realizing that I got some of the wrong parts. Now, is it better to leave the boards with smd components stuck on them (sitting in wet solder paste) until I can get the other parts, and then do the reflow all at once, or to reflow now, and then paste and heatgun (or just solder iron) the other parts in later?
I only have a few parts for which I need to do this, and I can stick the boards in a quiet refrigerator until I get the parts. I might not have ready access to a heat gun later, which is why this isn't a no-brainer (I'm imagining soldering iron+paste isn't the best way to do things, since I can't get to pads under the parts). Personally, I think the real question is whether reflowing twice negatively affects smd components, but context might prove it otherwise.