Is there a reliable way to etch a PCB(from working product) so as to be left with the surface without the substrate? Sometimes an existing PCB product which wasn't designed with weight, size or flexibility in mind is to be reworked.
Looking for a good process to address that aspect of existing PCBs for ultralight weight application projects(air water etc)
Mechanical approaches have serious drawbacks as most PCBs are dual sided but perhaps I am wrong?
Once left with the thinest possible layer of all active components it will be replaced with flexible PCB type base .
Edit : Would 'Aqua regia dissolve the copper/tin as well as the epoxy holding the fibreglass? That is about the only way of doing away with substrate sandwiched in dual sided PCB design