Wafer thickness reduction (750 µm to 50 µm)

Question

Need some suggestions as to what techniques one could possibly adopt to reduce wafer thickness to 50 µm or less while fulfilling these 2 conditions :

You need a chemical mechanical wafer polishing machine .... try Applied Materials (if they are still in business) or second hand... oh and some horrible chemicals they are too... good luck with the chip hacking. — Spoon, Commented Aug 12, 2016 at 16:40

matzeri · Accepted Answer · 2016-08-12 11:43:19Z

1

answered Aug 12, 2016 at 11:43

matzeri

3941 silver badge4 bronze badges

Add a comment |

1 Answer 1