Need some suggestions as to what techniques one could possibly adopt to reduce wafer thickness to 50 µm or less while fulfilling these 2 conditions :

  • Surface roughmess, Ra < 3nm
  • Total Thickness Variation < 3µm
  • \$\begingroup\$ very fine sandpaper? \$\endgroup\$
    – Icy
    Aug 12, 2016 at 9:33
  • 1
    \$\begingroup\$ You need a chemical mechanical wafer polishing machine .... try Applied Materials (if they are still in business) or second hand... oh and some horrible chemicals they are too... good luck with the chip hacking. \$\endgroup\$
    – Spoon
    Aug 12, 2016 at 16:40

1 Answer 1


May be you need to buy the right equipment ?


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