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Need some suggestions as to what techniques one could possibly adopt to reduce wafer thickness to 50 µm or less while fulfilling these 2 conditions :

  • Surface roughmess, Ra < 3nm
  • Total Thickness Variation < 3µm
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  • \$\begingroup\$ very fine sandpaper? \$\endgroup\$ – Icy Aug 12 '16 at 9:33
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    \$\begingroup\$ You need a chemical mechanical wafer polishing machine .... try Applied Materials (if they are still in business) or second hand... oh and some horrible chemicals they are too... good luck with the chip hacking. \$\endgroup\$ – Spoon Aug 12 '16 at 16:40
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May be you need to buy the right equipment ?
http://eesemi.com/backgrind.htm
http://www.syagrussystems.com/wafer-backgrinding

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