I have a power adapter PCB with through hole parts (only). The board itself has two external copper planes (3 oz) routed to the through hole parts without thermal reliefing (this is for a reason). At the assembly level, it is nearly impossible to fill the barrels of these through hole parts. I have a soldering iron and a IR reflow oven. Is there an efficient means of assembly using these two tools, to ensure 100% barrel fill. If not, are there any practical solutions for completing such a task?
The best method for this assembly is not IR reflow. There is a fairly cost effective method called dip soldering. The entire assembly bench I put together is less than $900.
A simple version of this assembly method is shown in the video below: https://www.youtube.com/watch?v=svLRtw18sXw
With all through hole parts (Assumed single staged with parts on one side), the entire board may be assembled, pre-baked, and then dipped to fill the barrels. The temperatures chosen at each stage must be crafted based on the design and tweaked experimentally to see what gives best results without damaging the hardware. Given my boards only house connectors, this is a simple process.