What is a reasonably safe temperature to use for desoldering SMD components using a hot-air rework gun? I have a new-to-me rework station from Xytronic and the documentation clearly assumes you know what you're doing… It tells you what temperature range the gun is capable of, but has nothing to say about where you should be setting it.
Also, I was surprised by how little air pressure the unit generates even when the AIR setting is set to max (99). Is this normal?
My one test so far was to desolder a random surface-mount IC package from a piece of electronic salvage I had lying around (kept for exactly this purpose). I tried to step up the temperature slowly, but I got all the way to 400 degrees Celsius before the chip seemed to suddenly be floating free. I never did see any visible change in the solder… (But perhaps that's just my eyesight.)
I am concerned that at that temperature any component that I can get off a board might be damaged by the heat.